Inside Solutions, LLC. (913-890-3737), a custom window covering company located in Overland Park, Kansas, has expanded its line of products that will enhance any home.

Overland Park, USA – February 2, 2022 —

The company’s new product line is ideal for customers who have moved into a new home, are looking to renovate or simply want to add a splash of color to their rooms. The customer will receive completely unique coverings as none of the company’s products are pre-made and there are hundreds of different fabrics and materials to choose from.

More information can be found at https://insidesolutionsllc.com

Inside Solutions’ recent expansion of window coverings includes curtains, drapes, shutters, shades, woven woods, cellular shades and roller shades. Their team of experts can come to the customer’s home for a consultation and measurement free of charge.

One of the benefits of having custom sidings is that not only will they fit the customer’s windows perfectly, but they will match the style of their home exactly. Pre-made options can end up being too big or too small and can warp and sag. The company’s professionals will work with the client to find the best choice for them, select colors that will match their interior, and suggest materials that can provide an increased level of privacy in the home.

Their wood and composite shutters are an elegant option that allows natural outdoor light to enter the house. They also minimize temperature transfers from indoors to outdoors and vice versa and can thus help reduce energy bill costs.

Customers can also opt for beautiful draperies and side panels in a diverse range of colors that will complement their home. These are very durable and can also enhance home privacy as they can completely block the view from outside.

Inside Solutions, LLC. is a family owned business in business since 2001. Their team is dedicated to providing unique, high quality window coverings at affordable prices.

One satisfied customer said, “Love my new blinds from Inside Solutions. Glenn is great to work with and has done all of my window coverings. He brought swatches to my house a couple of times, advised on style and color, and did preliminary measurements. Glenn brought in the installer for the final measurements and accompanied him for the installation. I highly recommend them.”

Interested parties can find more information by visiting https://insidesolutionsllc.com

Contact information:
Name: Glenn Roberts
Email: Send email
Organization: Inside Solutions, LLC.
Address: Overland Park, Overland Park, Kansas 66210, USA
Phone: +1-913-890-3737
Website: https://www.insidesolutionsllc.com

Build ID: 89061648

COMTEX_401622374/2773/2022-02-02T06:01:09

MOUNTAIN VIEW, CALIFORNIA, 20 October 2021 – Synopsys, Inc. today announced that it has expanded its strategic technology collaboration with TSMC to deliver the next level of system integration to meet increasingly critical performance, power and surface area goals for high performance computing (HPC) applications. By leveraging Synopsys’ 3DIC compiler platform, customers significantly advance the design of high-capacity 3D systems through efficient access to TSMC 3DFabric-based design methodologies. Those Methodologies provide 3D chip stacking support in System-on-Integrated-Chips (TSMC-SoIC) technology and advanced 2.5 / 3D packaging support in Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) technologies. The merging of support for these advanced methodologies into the highly integrated multi-die design of the 3DIC compiler platform addresses the complete challenge from exploration to approval, leading to the future realization of hyperconverged 3D systems of new generation comprising hundreds of billions of transistors in a single package.

“TSMC is working closely with our Open Innovation Platform (OIP) ecosystem partners to enable the next wave of innovation in the HPC space,” said Suk lee, vice president of TSMC’s Design Infrastructure Management division. “This joint effort combining Synopsys’ 3DIC compiler platform and TSMC’s advanced chip stacking and packaging technologies will help our customers meet design demands for power and performance and succeed in designs. state-of-the-art SoC for HPC applications.

The 3DIC Compiler platform is a complete end-to-end solution for efficient 2.5 / 3D multi-die design and full system integration. Built on the common single data model infrastructure of Synopsys Fusion Design Platform, the 3DIC compiler platform merges transformative multi-matrix design capabilities and takes advantage of world-class implementation and approval technologies from Synopsys to offer a complete exploration platform for approval – all in a single, consolidated 3DIC cockpit. This hyperconverged solution includes 2D and 3D visualization, cross-hierarchy exploration and planning, design and implementation, design for full system testing and validation, and approval analysis.

“The substantial scale-up required for the ever increasing increase in AI-centric and domain-optimized computing workloads requires bold leadership and far-reaching, collaborative innovation,” said Shankar Krishnamoorthy, Managing Director and Corporate Staff for the Silicon Realization Group at Synopsys. “Our pioneering work with TSMC on their latest 3DFabric technology allows us to imagine and achieve levels of 3D system integration previously unattainable. This leap forward in transistor performance, power and volume density will both impact and help shape many existing and emerging applications and markets, leveraging the 3DIC compiler platform and highly accessible integration technologies from TSMC.

The 3DIC Compiler platform delivers high levels of efficiency while increasing capacity and performance to provide seamless support for various heterogeneous processes and stacked arrays. By leveraging integrated approval solutions including Synopsys PrimeTime sync approval solution, StarRC parasite extraction approval, Tweaker ECO closure solution and IC Validator physical verification solution coupled with the Ansys RedHawk-SC Electrothermal family of multi-physics analysis solutions and testability with the Synopsys TestMax DFT solution, the 3DIC Compiler platform provides the best co- analysis for the fastest convergence to robust and efficient designs.

Learn more about the 3DIC compiler platform:
https://www.synopsys.com/implementation-and-signoff/3dic-design.html.

About Synopsys

Synopsys, Inc. is the Silicon to Software partner for innovative companies developing the electronics products and software applications we rely on every day. As a S&P 500 company, Synopsys has long been a global leader in electronic design automation (EDA) and semiconductor intellectual property and offers the broadest portfolio of testing tools and services. sector application security. Whether you are a system-on-a-chip (SoC) designer creating advanced semiconductors or a software developer writing more secure, high-quality code, Synopsys has the solutions to deliver innovative products. Learn more at www.synopsys.com.

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Source: Synopsis